R/F
-

-

48
详情 -

044
详情 -

043
详情 -

042
详情 -

6floors
MC P/N: T060_LDAC_V1.5_221028
详情
Layer number: 6
Sheet thickness: 0.6 mm +/-0.08 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Headphone
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: 800 microns
Minimum laser hole: 100 microns
Minimum line width: 110 microns
Minimum line spacing: 70 microns
Board standard: CLASS II -

38
详情 -

6floors
MC P/N: C06R20643X01
详情
Layer No.: 6
Board thickness: 0.6mm +/-0.1mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Consumer electronics
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: NA
Minimum laser hole: 100 microns
Minimum line width: 100 microns
Minimum line spacing: 50 microns
Board standard: CLASS II -

6floors
MC P/N: AN00100267A0
详情
Layer No.: 6
Board thickness: 1.2 mm +/-0.12 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial Control
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: 250 microns
Minimum laser hole: 100 microns
Minimum line width: 100 microns
Minimum line spacing: 100 microns
Board standard: CLASS III -

035
详情 -

033
详情 -

10floors
MC P/N: C10R20256X01
详情
Layer No.: 10
Board thickness: 2.0 mm +/-2.0 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial control
PCB structure: 3R+4F+3R
Minimum through-hole: 200 microns
Minimum laser hole: /
Minimum line width: 76.2 microns
Minimum line spacing: 76.2 microns
Board standard: CLASS III -

29
详情 -

28
详情 -

27
详情 -

10floors
MC P/N: C10R20255X01
详情
Layer No.: 10
Board thickness: 2.0 mm +/-2.0 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial control
PCB structure: 3R+4F+3R
Minimum through-hole: 200 microns
Minimum laser hole: /
Minimum line width: 76.2 microns
Minimum line spacing: 76.2 microns
Board standard: CLASS III -

6floors
MC P/N: 6S001-00562A0
详情
Layer number: 6
Panel thickness: 1.0 mm +/-0.1 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Mechanical control
PCB structure: 2R+2F+2R
Minimum through-hole: 200 microns
Minimum laser hole: NA
Minimum line width: 150 microns
Minimum line spacing: 100 microns
Board standard: CLASS III
-

4floors
MC P/N: 4C31600009A0
详情
Layer No.: 4
Sheet thickness: 0.6mm +/-0.1mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Consumer Electronics
PCB structure: 1R+2F+1R
Minimum through-hole: 200 microns
Minimum laser hole: NA
Minimum line width: 120 microns
Minimum line spacing: 100 microns
Board standard: CLASS II



